151-0621-00L Microsystems I: Process Technology and Integration
Semester | Autumn Semester 2022 |
Lecturers | M. Haluska, C. Hierold |
Periodicity | yearly recurring course |
Language of instruction | English |
Courses
Number | Title | Hours | Lecturers | ||||
---|---|---|---|---|---|---|---|
151-0621-00 V | Microsystems I: Process Technology and Integration The lecture starts in the second week of the Semester. | 3 hrs |
| C. Hierold, M. Haluska | |||
151-0621-00 U | Microsystems I: Process Technology and Integration The exercise starts in the third week of the Semester. | 3 hrs |
| M. Haluska |
Catalogue data
Abstract | Students are introduced to the fundamentals of semiconductors, the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow). |
Objective | Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow). |
Content | - Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS) - Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. - Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical properties. Application of selected technologies will be demonstrated on case studies. |
Lecture notes | Handouts (available online) |
Literature | - S.M. Sze: Semiconductor Devices, Physics and Technology - W. Menz, J. Mohr, O.Paul: Microsystem Technology - Hong Xiao: Introduction to Semiconductor Manufacturing Technology - M. J. Madou: Fundamentals of Microfabrication and Nanotechnology, 3rd ed. - T. M. Adams, R. A. Layton: Introductory MEMS, Fabrication and Applications |
Prerequisites / Notice | Prerequisites: Physics I and II |
Performance assessment
Performance assessment information (valid until the course unit is held again) | |
Performance assessment as a semester course | |
ECTS credits | 6 credits |
Examiners | C. Hierold, M. Haluska |
Type | session examination |
Language of examination | English |
Repetition | The performance assessment is offered every session. Repetition possible without re-enrolling for the course unit. |
Mode of examination | oral 20 minutes |
Additional information on mode of examination | Students registered for Microsystems I: Process Technology and Integration (151-0621-00) (MS I) course can voluntary participate in an interim examination which would count only as a bonus to the final grade of the MSI oral examination. This interim exam is written and graded and will contain assignments/problems from the selected parts of MSI lectures and tutorials presented until the day of the examination. Obtaining 80-100% of points at the interim exam improves the student’s grade at the final oral exam by max. 0.25 grades. The maximum grade (6.0) can also be achieved exclusively by the oral exam performance itself without resorting to the bonus from the interim exam. The interim exam will take 1 hour. The date and time of the interim exam will be noticed to students by the lecturer. No auxiliary means are allowed. Any behavior during the exam which violates the ETH ethical codex will result in both the loss of bonus points but also the application of standard disciplinary measures. |
This information can be updated until the beginning of the semester; information on the examination timetable is binding. |
Learning materials
No public learning materials available. | |
Only public learning materials are listed. |
Groups
No information on groups available. |
Restrictions
There are no additional restrictions for the registration. |