151-0621-00L Microsystems Technology
Semester | Autumn Semester 2016 |
Lecturers | C. Hierold, M. Haluska |
Periodicity | yearly recurring course |
Language of instruction | English |
Abstract | Students are introduced to the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow). |
Learning objective | Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow). |
Content | - Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS) - Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. - Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical and thermal properties, piezoelectric and piezoresitive materials. - Selected microsystems: Mechanical sensors and actuators, microresonators, thermal sensors and actuators, system integration and encapsulation. |
Lecture notes | Handouts (available online) |
Literature | - S.M. Sze: Semiconductor Devices, Physics and Technology - W. Menz, J. Mohr, O.Paul: Microsystem Technology - G. Kovacs: Micromachined Transducer Sourcebook |
Prerequisites / Notice | Prerequisites: Physics I and II |