Christofer Hierold: Catalogue data in Autumn Semester 2020

Name	Prof. Dr. Christofer Hierold
Field	Mikro- und Nanosysteme
Address	Chair in Micro and Nanosystems ETH Zürich, CLA G 9 Tannenstrasse 3 8092 Zürich SWITZERLAND
Telephone	+41 44 632 31 43
Fax	+41 44 632 14 62
E-mail	christofer.hierold@micro.mavt.ethz.ch
Department	Mechanical and Process Engineering
Relationship	Full Professor

Number	Title	ECTS	Hours	Lecturers
151-0620-00L	Embedded MEMS Lab	5 credits	3P	C. Hierold, S. Blunier, M. Haluska
Abstract	Practical course: Students are introduced to the process steps required for the fabrication of MEMS (Micro Electro Mechanical System) and carry out the fabrication and testing steps in the clean rooms by themselves. Additionally, they learn the requirements for working in clean rooms. Processing and characterization will be documented and analyzed in a final report. Limited access
Learning objective	Students learn the individual process steps that are required to make a MEMS (Micro Electro Mechanical System). Students carry out the process steps themselves in laboratories and clean rooms. Furthermore, participants become familiar with the special requirements (cleanliness, safety, operation of equipment and handling hazardous chemicals) of working in the clean rooms and laboratories. The entire production, processing, and characterization of the MEMS is documented and evaluated in a final report.
Content	With guidance from a tutor, the individual silicon microsystem process steps that are required for the fabrication of an accelerometer are carried out: - Photolithography, dry etching, wet etching, sacrificial layer etching, various cleaning procedures - Packaging and electrical connection of a MEMS device - Testing and characterization of the MEMS device - Written documentation and evaluation of the entire production, processing and characterization
Lecture notes	A document containing theory, background and practical course content is distributed at the Introductory lecture day of the course.
Literature	The document provides sufficient information for the participants to successfully participate in the course.
Prerequisites / Notice	Participating students are required to attend all scheduled lectures and meetings of the course. Participating students are required to provide proof that they have personal accident insurance prior to the start of the laboratory portion of the course. For safety and efficiency reasons the number of participating students is limited. We regret to restrict access to this course by the following rules: Priority 1: master students of the master's program in "Micro and Nanosystems" Priority 2: master students of the master's program in "Mechanical Engineering" with a specialization in Microsystems and Nanoscale Engineering (MAVT-tutors Profs Daraio, Dual, Hierold, Koumoutsakos, Nelson, Norris, Poulikakos, Pratsinis, Stemmer), who attended the bachelor course "151-0621-00L Microsystems Technology" successfully. Priority 3: master students, who attended the bachelor course "151-0621-00L Microsystems Technology" successfully. Priority 4: all other students (PhD, bachelor, master) with a background in silicon or microsystems process technology. If there are more students in one of these priority groups than places available, we will decide by (in following order) best achieved grade from 151-0621-00L Microsystems Technology, registration to this practicum at previous semester, and by drawing lots. Students will be notified at the first lecture of the course (introductory lecture) as to whether they are able to participate. The course is offered in autumn and spring semester.
151-0621-00L	Microsystems I: Process Technology and Integration	6 credits	3V + 3U	M. Haluska, C. Hierold
Abstract	Students are introduced to the fundamentals of semiconductors, the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow).
Learning objective	Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow).
Content	- Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS) - Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. - Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical properties. Application of selected technologies will be demonstrated on case studies.
Lecture notes	Handouts (available online)
Literature	- S.M. Sze: Semiconductor Devices, Physics and Technology - W. Menz, J. Mohr, O.Paul: Microsystem Technology - Hong Xiao: Introduction to Semiconductor Manufacturing Technology - M. J. Madou: Fundamentals of Microfabrication and Nanotechnology, 3rd ed. - T. M. Adams, R. A. Layton: Introductory MEMS, Fabrication and Applications
Prerequisites / Notice	Prerequisites: Physics I and II
151-0642-00L	Seminar on Micro and Nanosystems	0 credits	1S	C. Hierold
Abstract	Scientific presentations from the field of Micro- and Nanosystems
Learning objective	In particular, the seminar addresses students, who are interested in scientific work in the field of Micro- and Nanosystem technologies, or who have started already with it. Respectively, current examples in the research will be discussed.
Content	Current themes in the field of Micro- and Nanosystem technologies using the examples of intern and extern research groups, as well as ongoing themes of study-, diplom- and doctoral thesis will be introduced and discussed. The scope of the seminar is broadened by occasional guest speakers.
Lecture notes	-
Literature	-
Prerequisites / Notice	Master of MNS, MAVT, ITET, Physics